新產品·新技術信息

填充銀環氧膠黏劑應用溫度達到480°F

來源：林中祥膠粘劑技術信息網2014年02月10日

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Silver-Filled Epoxy Adhesive suits applications up to 480°F.

Formulated using high purity silver flake, Aremco-Bond 556-HTHC is used for microelectronic chip bonding, semiconductor die-attach, hybrid packaging, and other electrical/electronic assembly applications. Two-part, electrically and thermally conductive adhesive exhibits low volume resistivity of less than 0.0001 Ω-cm at room temperature and thermal conductivity of 2.2 W/m-°K. Product offers tensile shear strength of 1,700 psi, Shore D hardness of 90, and viscosity range of 40,000?45,000 cP.

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新產品·新技術信息

填充銀環氧膠黏劑應用溫度達到480°F

Silver-Filled Epoxy Adhesive suits applications up to 480°F.

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